Syenta, a semiconductor company that builds advanced packaging technology, has raised US$26 million in its Series A funding round. The round was led by Playground Global and Australia’s National Reconstruction Fund (NRF), with support from investors like Investible, Salus Ventures, Jelix Ventures, and Wollemi Capital. This brings Syenta’s total funding to over US$36 million.
As part of the investment, Pat Gelsinger from Playground Global will join Syenta’s board. The new funding will help the company grow its business, expand into the United States, and prepare for large-scale production of its technology.
“Today’s advanced packaging approaches have real limits on interconnect density, which constrain the bandwidth between chips,” said Dr. Jekaterina Viktorova, CEO and founder of Syenta. “We’re enabling finer-pitch connections within existing manufacturing infrastructure, allowing systems to move more data more efficiently and at a lower cost without requiring entirely new fabrication approaches.”
“This is a new way of building high-performance systems at unprecedented scale and power, particularly as AI workloads continue to grow,” said Pat Gelsinger, general partner at Playground Global. “AI’s next scaling challenge isn’t just compute, it’s how chips connect. What’s compelling about Syenta is that the company is tackling a key constraint in advanced packaging and contributing to the expansion of a more resilient global semiconductor ecosystem.”
“Syenta exemplifies the type of globally competitive, high-impact innovation the NRF was created to support,” said Dr. Mary Manning, chief investment officer, NRF. “By advancing next-generation packaging technologies, Syenta strengthens Australia’s role in critical supply chains while contributing to global semiconductor resilience.”
Founded in 2022 by Dr. Jekaterina Viktorova, Ben Wilkinson, Prof Luke Connal, and Zachary Dowse, Syenta is a semiconductor technology company based in Sydney, Australia. It was started using research from the Australian National University.
The company has created a technology called Localised Electrochemical Manufacturing (LEM). This process helps connect chips more efficiently in advanced semiconductor packaging, enabling smaller, more powerful chips.
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