The Global Electronics Association (previously called IPC) and Mimos Bhd have signed an agreement to work together and support Malaysia’s electronics and semiconductor industry.
This partnership aims to strengthen the country’s position in the global electronics market.
They will focus on improving advanced electronic packaging, aligning industry standards, and following global best practices.
Mimos Technologies CEO Afdzal Syahadat Husin said the industry in Malaysia is going through an important stage of change.
This change is happening because new technologies are becoming more complex and there is a growing need for advanced electronic packaging solutions.
“This collaboration reflects a shared commitment to strengthening Malaysia’s position within the global value chain by fostering deeper industry alignment, accelerating capability development, and advancing the adoption of globally recognised standards and best practices.
“Through this partnership, MIMOS aims to catalyse innovation, enhance ecosystem readiness, and support the nation’s ambitions to become a leading hub for high-value electronics manufacturing in the region,” he said.
Meanwhile, Global Electronics Association country manager for Malaysia Dr Ranee Ramya said strengthening industry alignment, advancing standards adoption, and enabling initiatives such as continuous quality improvement programmes and validation services are critical to positioning Malaysia as a leading hub for advanced electronics in South-East Asia.
This agreement builds on the Global Electronics Association’s growing presence in Malaysia.
It shows their commitment to supporting innovation and helping the electronics industry grow in one of the region’s key hubs.
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