Silicon Box Raises $77.5 Mn in Funding by Ares Management Corporation

The company is using its technology to solve challenges in next-generation chip design, as traditional methods of making chips are reaching their physical and cost limits. Its proprietary SiPlet® technology and panel-level packaging help improve performance and efficiency in semiconductor production.

Since starting high-volume production last year, Silicon Box has seen strong business growth. By Q1 2026, it has shipped over 250 million units from its Singapore manufacturing facility with very high production quality and yield.

“We are pleased to support Silicon Box in this next phase of growth,” said Dinesh Goel, Partner at Ares. “The company has demonstrated strong execution capabilities and operates at the leading edge of advanced packaging – a strategically important segment of the semiconductor value chain. We believe that Silicon Box is well-positioned to scale globally and this financing reflects our confidence in the management team and the long-term growth outlook for advanced packaging.”

“In capital-intensive industries like semiconductor manufacturing access to flexible and scalable funding is critical to capturing growth opportunities. The proceeds will be deployed for capacity expansion to meet the rapidly growing market demand,” said Dr. BJ Han, co-founder and CEO of Silicon Box. "This financing enhances our capital base while minimising shareholder dilution, and we are pleased to partner with Ares, InnoVen, Abound and January Capital. Their support reinforces confidence in our strategy and enables us to execute on our global expansion plans."

Founded in 2021 by Dr. Byung Joon (BJ) Han, Dr. Sehat Sutardja and Weili Dai, Silicon Box is a company that works in advanced semiconductor packaging and chip manufacturing. It focuses on modern chiplet technology and provides more efficient and cost-effective alternatives to traditional chip packaging methods.

The company uses its own technology, along with over 30 years of industry experience and strong partnerships, to solve challenges in chiplet adoption. Its goal is to support the development of new technologies that are shaping the future of electronics and computing.

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