Lightmatter, a leader in photonic interconnect technology for AI, has partnered with Global Unichip Corp. (GUC), a top company in advanced ASIC design, to bring new 3D Co-Packaged Optics (CPO) solutions to the market.
The partnership combines Lightmatter’s Passage photonic interconnect technology with GUC’s advanced chip design and packaging expertise. Together, they aim to create faster and more efficient connections between AI chips.
This joint solution is designed to address major connectivity issues that slow the growth of advanced AI and high-performance computing systems, especially in large data centers worldwide.
“The fundamental architecture of computers is changing. The world has hit a wall in per-silicon area performance; the network is becoming the computer, and that network needs to run on light. GUC has unmatched ASIC engineering execution in this rapidly-evolving landscape. Pairing their silicon expertise with our photonic interconnects provides the industry with a concrete path to escape the energy and performance traps of legacy signaling, enabling the massive scale-up required for tomorrow’s intelligence,” said Nick Harris, founder and CEO of Lightmatter.
“To enable our hyperscale customers to deliver the most competitive services, we need partners with proven, superior technology,” said Igor Elkanovich, CTO of GUC. “Integrating Lightmatter’s Passage CPO platform into our world-class ASIC designs allows us to bring to market a joint solution that fundamentally redefines AI interconnect. Our combined expertise solves complex challenges—architectural, thermal, mechanical, and signal integrity. It ensures that customers receive a robust, power-efficient, and scalable CPO platform that accelerates their path to large-scale AI deployment.”
“Optical interconnect is no longer a luxury; it is a necessity for hyperscale AI to continue its exponential growth path,” said Dr. Wei-Chung Lo, Deputy General Director at Electronic & Optoelectronic System Research Laboratories (EOSL) of Industrial Technology Research Institute (ITRI), Taiwan. “The combination of GUC’s extensive experience in custom AI silicon design for top-tier cloud providers and Lightmatter’s innovation signals to the market that the supply chain is maturing, providing a credible blueprint for hyperscalers to address the critical bandwidth and power constraints of the next generation of AI clusters.”
Lightmatter is transforming AI data center infrastructure by developing technologies that enable systems to process and move data much faster. Its key products include the Passage platform, the world’s first 3D-stacked silicon photonics engine, and Guide a high-speed light engine. These technologies efficiently connect thousands to millions of AI processors.
Lightmatter’s solutions are designed to remove data bottlenecks that slow down AI and high-performance computing. By offering very high data speeds while using less energy, Lightmatter is helping redefine how next-generation AI data centers are built.
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