FusionAP Sdn Bhd, a semiconductor packaging company based in Malaysia, has raised US$2 million (RM8 million) in a pre-seed funding round.
The funding round was co-led by Vertex Ventures Southeast Asia & India and Southern Capital Group.
FusionAP Sdn Bhd is building an advanced semiconductor packaging and testing platform that works with global chip design companies, foundries, and technology partners. The company focuses on advanced 2.5D and 3D chip packaging technologies, supporting projects from early prototypes to full production.
The new funding will be used to expand engineering and research work, improve technology integration, develop intellectual property, and build pilot production capacity. FusionAP has also received an offer for a matching research grant from the Malaysia Science Endowment under Malaysia’s Ministry of Science, Technology and Innovation (MOSTI).
Commenting on the fundraise, Teng Chow Ooi, Founder, FusionAP, said, “We formed FusionAP to solve the most pressing bottleneck in semiconductor scaling. We are very thankful for the trust placed on us by Vertex Ventures SEA and India, Southern Capital and the Malaysian government. We are ready to move full-speed ahead to become a key OSAT player in advanced packaging!”
Chan Yip Pang, Executive Director, Investment, Vertex Ventures SEA and India, commented, “Advanced packaging is both the critical bottleneck and the critical enabler in next-generation semiconductor performance. Teng Chow and the team bring rare deep domain expertise to one of the most strategically important layers of the chip stack. We’re excited to back FusionAP as they build a world-class advanced packaging platform out of Malaysia and position Southeast Asia as a key node in the global semiconductor supply chain.”
Founded in 2025 by Teng Chow Ooi, FusionAP Sdn Bhd is a Malaysia-based company that focuses on advanced semiconductor packaging technologies for next-generation chips.
The company works with global chip design firms, foundries, and technology partners to develop 2.5D, 3D, and future-ready chip packaging solutions. FusionAP supports projects from early testing stages to large-scale production and aims to provide a reliable and geopolitically neutral semiconductor packaging and testing service.
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