GlobalFoundries has made a deal $2 billion with TSMC to supply parts

As part of this agreement GlobalFoundries will make silicon interposers at its plant in Malta, New York for TSMCs Chip-on-Wafer-on-Substrate ( packaging platform. GlobalFoundries said on October 8 that mass production will begin to increase in the half of 2028.

GlobalFoundries to Increase Manufacturing Capacity in the US

The agreement is for five years. Includes parts that let GlobalFoundries increase its capacity if customers need more silicon interposers. GlobalFoundries plans to add production lines to support advanced packaging products, including parts that use embedded deep trench capacitor technology.

The companies have not given production targets, customer shares or a detailed timeline for expansions.

GlobalFoundries said this project is the US-based source of silicon interposers for packaging. This deal is meant to make the supply chain stronger for parts that power performance computing and artificial intelligence systems.

Why Silicon Interposers Are Important for AI Chips

Silicon interposers connect processors, chiplets and high-bandwidth memory (HBM) inside semiconductor packages. They make high-speed links that help these parts work together smoothly.

TSMC’s CoWoS technology connects processors with HBM stacks to manage tasks like AI training and inference. Because AI accelerators need power and memory bandwidth advanced packaging has become more important in semiconductor manufacturing.

As part of this agreement GlobalFoundries will make silicon interposers for TSMC. GlobalFoundries will not assemble the CoWoS package.

The companies have not said which AI chips or final customers will use the parts made in New York.

TSMC Expands Its Advanced Packaging Supply Chain

This deal is happening as TSMC keeps adding to its packaging capacity in Taiwan. In September 2026 an advanced packaging park backed by TSMC started to be built in Kaohsiung showing investment in Taiwan’s semiconductor infrastructure.

The new deal adds a US manufacturing source for part of TSMC’s packaging network. It also gives GlobalFoundries a long-term role in the AI semiconductor supply chain.

GlobalFoundries has semiconductor manufacturing sites in the United States, Europe, Asia and Singapore. TSMC is still the contract semiconductor manufacturer that makes chips for companies that create processors and AI chips.

About GlobalFoundries

GlobalFoundries is a semiconductor manufacturer that offers chip fabrication and related services to customers in industries.

GlobalFoundries has manufacturing sites, in the United States, Europe and Asia supporting uses in automotive, communications, industrial systems and computing.

About TSMC

Taiwan Semiconductor Manufacturing Co. (TSMC) is a semiconductor foundry that builds chips designed by companies.

TSMC’s technologies support uses in intelligence, high-performance computing, smartphones, automotive systems and other electronic devices.

The company also develops packaging technologies, like CoWoS to combine processors and high-bandwidth memory into high-performance semiconductor systems.

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