Intel (INTC) has announced a new investment of 860 million Malaysian Ringgit (about $208 million) to upgrade its packaging and testing facilities in Malaysia.
This investment will help boost Malaysia’s position in the global semiconductor supply chain, making the country an even more important player in the industry.
Malaysian Prime Minister Anwar said that during his meeting with Intel’s CEO, the company showed strong confidence in Malaysia’s long-term development plans, which helped drive this new investment.
Intel already has major operations in Malaysia, including an advanced packaging facility in Penang that is 99% complete and worth 12 billion Ringgit. In 2021, the company also committed $7 billion to build a production base in Penang.
In another meeting, Tan and senior leaders from Intel met with Digital Minister Gobind to talk about the future of semiconductors, the growth of AI, and developing local talent.
Gobind said these areas are critical for Malaysia’s goals and progress as the country plans ahead toward 2026.
“Since 1972, Intel has played a pivotal role in Malaysia’s social and economic development through its contributions to high-tech manufacturing, design and development, global services, and community impact,”Gobind stated.
The new investment comes as Intel’s advanced packaging facility in Penang nears completion. Anwar shared that the RM12 billion facility is now 99% finished, making it one of Intel’s biggest projects in Southeast Asia.
“Intel also expressed its appreciation for the continuous support of the Malaysian government, particularly for the development of the advanced packaging facility in Penang,” Anwar stated.
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