Makr Microsystems Raises $1.08 million to Develop Advanced Semiconductor Inspection Technology

The company will use the new funding to develop its technology, test and validate its products with customers, and bring them to the market.

Makr Microsystems wants to develop advanced semiconductor equipment and technology in India that can compete in global markets.

Its technology can measure structures inside semiconductor chips without damaging them. This could help manufacturers working on advanced chip packaging, hybrid bonding, and 3D chip technologies.

The investment also shows that investors are becoming more interested in the equipment and measurement technologies used in semiconductor manufacturing.

With its new funding, Makr plans to improve its technology, test it with customers, and bring it to market. The company aims to meet the growing demand for advanced and non-destructive chip inspection.

Makr Microsystems was founded by Ashwin Lal. The company is developing advanced technology that can measure tiny 3D structures beneath the surface of semiconductor chips.

Its platform combines Acoustic Atomic Force Microscopy (AAFM), optical tomography, and 3D data analysis. This helps chip manufacturers measure hidden structures and find defects without damaging the chips.

Makr’s technology can be used for advanced chip packaging, hybrid bonding, buried connections, chiplet interconnects, and detecting defects inside semiconductor devices.

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